Electronic device testing apparatus and electronic device testing method

ABSTRACT

The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

BACKGROUND OF THE INVENITON Field of the Invention

The present invention relates to an electronic device testing apparatusand an electronic device testing method, in particular to a testingapparatus and a testing method for determining quality of electronicdevices.

Description of the Related Art

As electronic devices having complex functions are continuouslydeveloped, test of the electronic devices becomes more complicated, andthe test becomes time-consuming. Therefore, optimization of theefficiency of the testing apparatus, for example, the efficiency of thesorting and transferring process of chips to be tested and tested chips,the temperature control process, the process of handling trays or thelike, becomes more and more important. In order to maximize productioncapacity, manufacturers of a testing apparatus make a great effort tooptimize test efficiency. In addition, the large size of the existingtesting apparatus is disadvantageous to the layout of the site space.Therefore, it is also very important to optimize the layout of eachfunctional unit of the testing apparatus.

A conventional technology is disclosed in Taiwanese Patent No. 1551529entitled “Electronic Device Operating Machine”. FIG. 1 which isreproduced from FIG. 3 of Taiwanese Patent No. 1551529 is a schematicview of a conventional electronic device operating machine. As shown inthe figure, one end of the operating machine is provided with a feedingdevice 130 and a receiving device 140. The feeding device 130 isprovided for loading electronic devices to be tested, and the receivingdevice 140 is provided for loading tested electronic devices.

The other end of the operating machine is provided with an operatingdevice 150 for testing electronic devices. A first transferring device162 includes a first picking member 621 and a second picking member 622.The first picking member 621 is provided for transferring the electronicdevices to be tested from the feeding device 130 to the first carrierplatform 161, and the second picking member 622 is provided fortransferring the tested electronic devices from the first carrierplatform 161 to the receiving device 140.

The operation flow of the conventional electronic device operatingmachine will be described as follows. First, the first picking member621 transfers the electronic devices to be tested from the feedingdevice 130 to the first carrier platform 161. The first carrier platform161 moves into the operating device 150. After the pressing and pickingdevice of the operating device 150 picks up the electronic devices to betested, the first carrier platform 161 moves out of the operating device150 and returns to the departure position so that other electronicdevices to be tested are transferred to the first carrier platform 161by the first picking member 621. On the other hand, the pressing andpicking device of the operating device 150 places the electronic devicesto be tested into test sockets so that the electronic devices are testedtherein.

When the test is completed, the pressing and picking device of theoperating device 150 picks up the tested electronic devices from thetest sockets, the first carrier platform 161 moves into the operatingdevice 150 again, the pressing and picking device of the operatingdevice 15 places the tested electronic devices into the first carrierplatform 161, and the first carrier platform 161 slightly moves so as toallow the pressing and picking device to pick up the other electronicdevices to be tested. Next, the first carrier platform 161 returns tothe departure position so that the second picking member 622 picks upthe tested electronic devices from the first carrier platform 161, andthe first picking member 621 places the electronic devices to be testedin the first carrier platform 161. At the same time, the pressing andpicking device of the operating device 150 places the electronic devicesto be tested into the test sockets so that the electronic devices aretested therein.

As mentioned above, in the conventional electronic device operatingmachine, the electronic devices to be tested and the tested electronicdevices are conveyed solely by the first carrier platform 161 so thatthe first carrier platform 161 are moved reciprocatedly and frequently.When the system operates for a time period, the preset stop position isshifted easily, resulting in an error in the pick-and-place position.The complicated transferring process directly affects the testefficiency, prolonging a test suspending time necessary for feeding inor feeding out the electronic devices. In addition, it can be clearlyseen from FIG. 1 that the conventional electronic device operatingmachine has an unfavorable spatial layout and too much free space, andfunctions thereof are simple. The capacity for loading electronicdevices to be tested and tested electronic devices is obviouslyinsufficient.

SUMMARY OF THE INVENTION

The main object of the present invention is to provide an electronicdevice testing apparatus and an electronic device testing method capableof shortening the test suspending time necessary for feeding in orfeeding out electronic devices, thereby effectively improving the testefficiency and capable of optimizing the spatial layout and providingmore functions and a greater capacity for loading electronic devices tobe tested and tested electronic devices.

To achieve the above object, the present invention provides anelectronic device testing apparatus, comprising a feeding zone, a testzone, a discharging zone, an input carrier, an output carrier and apick-and-place device. The feeding zone is used for loading anelectronic device to be tested; the test zone includes a pressing headand a test socket, the pressing head includes a suction nozzle forpicking or placing the electronic device to be tested, and the testsocket is used for accommodating and testing the electronic device to betest; the discharging zone is used for loading a tested electronicdevice; the input carrier is used for transferring the electronic deviceto be tested into the test zone; the output carrier is used fortransferring the tested electronic device out of the test zone; thepick-and-place device is used for transferring the electronic device tobe tested between the feeding zone and the input carrier and fortransferring the tested electronic device between the output carrier andthe discharging zone. After the electronic device to be tested is testedin the test zone and becomes the tested electronic device, the pressinghead picks up the tested electronic device from the test socket, theoutput carrier moves into the test zone, the pressing head places thetested electronic device on the output carrier, the output carrier movesout of the test zone, and the input carrier follows immediately afterthe output carrier and successively moves into the test zone at the samespeed; after the pressing head picks up the electronic device to betested from the input carrier, the input carrier moves out of the testzone, and the pressing head places the electronic device to be tested inthe test socket.

Accordingly, in the present invention, the electronic device to betested and the tested electronic device are transferred by the inputcarrier and the output carrier respectively, thereby eliminating thedefect of the existing apparatus that a single carrier platform is movedreciprocatedly and frequently and greatly improving the transferefficiency. In addition, the pressing head of the present invention canoperate smoothly without a break during the feed-in period and thefeed-out period. Specifically, after the tested electronic device isplaced into the output carrier, movement of the input carrier into thetest zone is synchronous with movement of the output carrier out of thetest zone. At this time, the pressing head can pick up the electronicdevice to be tested so that the test can be carried out immediatelyafter the input carrier moves out of the test zone. In other words, inthe present invention, the operation of the pressing head is simplified,the overall test efficiency is improved, and unnecessary transferactions are eliminated due to use of the output carrier and the inputcarrier, thereby reducing energy consumption and improving the servicelife of the apparatus.

Preferably, the electronic device testing apparatus of the presentinvention may further comprise a housing and a dust-proof slide cover.The feeding zone may include a first tray, a tray conveying device, anouter area and an inner area. The inner area of the feeding zone, thetest zone, the input carrier, the output carrier, the pick-and-placedevice and at least a part of the discharging zone may be arranged inthe housing. The tray conveying device is used for transferring thefirst tray from the outer area to the inner area. The electronic deviceto be tested may be loaded on the first tray. The dust-proof slide covercan be arranged outside the housing and can be slidably moved to coverthe outer area of the feeding zone or slidably moved away from the outerarea. Accordingly, when the electronic device to be tested is stored inthe outer area of the feeding area, the dust-proof slide cover canprevent the electronic device to be tested from contamination. Thedust-proof slide cover can be slidably moved away from the outer area ofthe feeding zone so that the electronic device to be tested can be fedin easily.

Furthermore, the discharging zone of the electronic device testingapparatus of the present invention may include a second tray, a traytranslating device, a first area, a second area and a tray knockingdevice. The first area may be provided in the housing; the traytranslating device may be used for transferring the second tray from thefirst area to the second area; the tested electronic device may beloaded on the second tray; the tray knocking device may be arranged inthe second area and may knock the second tray at a specific frequency.In other words, in the present invention, the second tray may bevibrated by the tray knocking device so that the tested electronicdevice which is not exactly positioned in an electronicdevice-accommodating slot can smoothly get into the slot.

To achieve the above object, the present invention provides anelectronic device testing method, mainly comprising the steps of:transferring an electronic device to be tested from a feeding zone to aninput carrier by a pick-and-place device; transferring the electronicdevice to be tested to a test zone by the input carrier, the test zoneincluding a pressing head and a test socket; moving the input carrierout of the test zone after the electronic device to be tested is pickedup from the input carrier by the pressing head; placing the electronicdevice to be tested into the test socket and testing the electronicdevice to be tested by the pressing head; picking up a tested electronicdevice from the test socket by the pressing head, moving an outputcarrier into the test zone, and placing the tested electronic deviceinto the output carrier by the pressing head; moving the output carrierout of the test zone while the input carrier follows immediately afterthe output carrier and successively moves into the test zone at the samespeed; and repeating the above-mentioned steps.

In other words, in the electronic device testing method provided by thepresent invention, after the test is completed, during a pick-and-placeoperation of the pressing head, the electronic device to be tested isfed in by the input carrier and the test electronic device is fed out bythe output carrier. Movement of the input carrier into the test zone issynchronous with movement of the output carrier out of the test zone.Thereby, the present invention significantly shortens the idle time ofthe test and can greatly improve the operation efficiency of theapparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a conventional electronic device operatingmachine.

FIG. 2A is a top view of an apparatus according to a preferredembodiment of the present invention.

FIG. 2B is a schematic view of the apparatus according to the preferredembodiment of the present invention.

FIG. 3 is a perspective view showing the appearance of the apparatusaccording to the preferred embodiment of the present invention.

FIGS. 4A to 4E are schematic top views showing a test transfer operationaccording to a preferred embodiment of the present invention.

FIGS. 5A to 5E are schematic front views showing the test transferoperation according to the preferred embodiment of the presentinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before an electronic device testing apparatus and a testing methodthereof according to the present invention are described in detail inthe embodiments, it should be noted that in the following description,similar components will be designated by the same reference numerals.Furthermore, the drawings of the present invention are for illustrativepurposes only, they are not necessarily drawn to scale, and not alldetails are necessarily shown in the drawings.

The layout of each functional unit of an apparatus of a preferredembodiment will be described in the following description by referringto FIGS. 2A and 2B. FIG. 2A is a top view of the apparatus according tothe preferred embodiment of the present invention, and FIG. 2B is aschematic view of the apparatus according to the preferred embodiment ofthe present invention. As shown in the figures, the plane layout of theapparatus in this embodiment mainly includes: a feeding zone 2, an emptytray zone 9, a discharging zone 5, a temperature control zone 3, afeeding buffer zone 60, a test zone 4, a discharging buffer zone 70 anda tested chip buffer zone FD.

Reference is made to FIG. 3 , which is a perspective view of theapparatus according to the preferred embodiment of the presentinvention. As shown in FIG. 3 , the apparatus of this embodimentincludes a housing H. The feeding zone 2 includes a first tray 21, atray conveying device 22, an outer area 23 and an inner area 24. Thedischarging zone 5 includes a second tray 51, a tray translating device52, a first area 53, a second area 54 and a tray knocking device 55. Theempty tray zone 9 includes an empty tray storage zone 91, an empty traybuffer zone 92, an empty tray transferring device 93 and an empty trayconveying device 94.

As shown in FIG. 3 , in the present embodiment, only the outer area 23of the feeding zone 2, the second area 54 of the discharging zone 5 andthe empty tray storage zone 91 of the empty tray zone 9 are providedoutside the housing H for facilitating feeding in the electronic devicesto be tested and feeding out the tested electronic devices and the emptytrays. In this embodiment, a dust-proof slide cover 25 is arrangedoutside the housing H, and partitions 26 are arranged on both sides ofthe outer area 23 of the feeding zone 2. The dust-proof slide cover 25is of an L-shaped form two ends of which are coupled to slide railsoutside the housing H so that the dust-proof slide cover 25 can beslidably moved in a horizontal direction. When the electronic devices tobe tested are to be fed in, the dust-proof slide cover 25 can beslidably moved away from the outer area 23. When the electronic devicesto be tested have been fed in, the dust-proof slide cover 25 can beslidably moved back to the outer area 23. With the cooperation of thepartitions 26 on both sides of the outer area 23, the outer area 23becomes a closed space capable of preventing the electronic devices tobe tested from contamination.

The tray conveying device 22 of the feeding zone 2 may be a conveyorbelt for transferring the first tray 21 from the outer area 23 to theinner area 24 inside the housing H, and the first tray 21 is loaded withthe electronic devices Cy to be tested. On the other hand, the emptytray transferring device 93 may be a tray gripper device fortransferring an empty tray from the inner area 24 to the empty traybuffer zone 92. When all the electronic devices Cy to be tested on thefirst tray 21 of the inner area 24 have been taken away, the empty trayis moved from the inner area 24 to the empty tray buffer area 92 outsidethe housing H by the empty tray transferring device 93. On the otherhand, the empty tray located in the empty tray buffer zone 92 is thentransported to the empty tray storage area 91 by the empty trayconveying device 94 which may be a conveyor belt.

As to the discharging zone 5, the first area 53 is provided in thehousing H, and the tray translating device 52 of this embodiment may bea conveyor belt for transferring the second tray 51 from the first area53 to the second area 54, and the second tray 51 is used for loading thetested electronic devices Cf. As shown in the figure, the presentembodiment includes three tray translating devices 52 each of whichcarries one second tray 51. The tested electronic devices Cf are sortedand loaded on the three second trays 51 according to with test results,such as good products, defective products and retested products.

It is inevitable that the electronic devices are not properly placed inthe electronic device-accommodating slots of the second tray 51 in theprocess of picking and placing the electronic devices or that theelectronic devices fall out of the electronic device-accommodating slotsin the transfer process of the second tray 51. Accordingly, in thepresent embodiment, the tray knocking device 55 is specially arranged inthe second area 54 and is capable of knocking the second tray 51 at aspecific frequency, that is, the second tray 51 can be vibrated by thetray knocking device 55 so that the tested electronic devices which arenot exactly positioned in the electronic device-accommodating slots cansmoothly get into the slots. The tray knocking device 55 in thisembodiment may be a small pneumatic cylinder. Of course, otherequivalent devices that can generate percussion, impact or vibration ata specific frequency are applicable.

As shown in the figure, the temperature control zone 3 is arranged onone side of the feeding zone 2. Since the apparatus in this embodimentis used for a high temperature test, the temperature control zone 3 isprovided as a heating zone, which includes a first preheating zone 31and a second preheating zone 32. The first preheating zone 31 and thesecond preheating zone 32 can be provided as two heating zones withdifferent temperatures, such as 120° C. and 60° C. The tested chipbuffer zone FD may be used to temporarily store tested electronicdevices that have to be retested or temporarily store electronic devicesthat have not yet been tested due to interruption of the test caused byfailure of the apparatus or other reasons.

As shown in FIG. 2A and FIG. 2B, the feeding buffer zone 60, the testzone 4 and the discharging buffer zone 70 in this embodiment arearranged in a straight line along the guide rail 40, and the guide rail40 is also coupled to the input carrier 6 and the output carrier 7. Theinput carrier 6 is capable of moving between the feeding buffer zone 60and the test zone 4, and the output carrier 7 is capable of movingbetween the test zone 4 and the discharging buffer zone 70.

The pick-and-place device 8 as shown in the figure includes a feedingpick-and-place module 81 and a discharging pick-and-place module 82. Thefeeding pick-and-place module 81 is provided for transferring theelectronic devices Cy to be tested among the feeding zone 2, thetemperature control zone 3 and the input carrier 6. The dischargingpick-and-place module 82 is provided for transferring the testedelectronic devices Cf between the output carrier 7 and the dischargingzone 5.

The feeding and discharging process of this embodiment will be describedbelow. Reference is made to FIG. 2A and FIG. 2B again. After the firsttray 21 is transferred from the outer area 23 to the inner area 24inside the housing H by the tray conveying device 22, the electronicdevices Cy to be tested is picked up from the first tray 21 andtransferred to the temperature control zone 3 by the feedingpick-and-place module 81 so as to regulate the temperature of theelectronic devices Cy to be tested. When the temperature of theelectronic devices Cy to be tested reaches a specific temperature (forexample, 60° C.), the feeding pick-and-place module 81 picks up theelectronic devices Cy to be tested from the temperature control zone 3,transfers the electronic devices Cy to be tested to the feeding bufferzone 60 and places them on the input carrier 6.

Next, the process of a test transfer operation according to a preferredembodiment will be described below. Reference is made to FIGS. 4A to 4Eand FIGS. 5A to 5E. FIGS. 4A to 4E are schematic top views showing thetest transfer operation of the preferred embodiment of the presentinvention, and FIGS. 5A to 5E are schematic front views showing the testtransfer operation of the preferred embodiment of the present invention.When the input carrier 6 receives the electronic devices Cy to betested, the input carrier 6 moves from the feeding buffer zone 60 to thetest zone 4. FIG. 4A and FIG. 5A show the situation before movement ofthe input carrier 6 while FIG. 4B and FIG. 5B show the situation aftermovement of the input carrier 6. The test zone 4 of this embodimentincludes a pressing head 41 and a plurality of test sockets 42. Thepressing head 41 has a plurality of suction nozzles 411 and can belifted or lowered, and the test sockets 42 can accommodate electronicdevices and test the accommodated electronic devices.

Then, the pressing head 41 is lowered to pick up the electronic devicesCy to be tested with the suction nozzles 411 as shown in FIG. 4B andFIG. 5B. After the electronic devices Cy to be tested are successfullypicked up, the pressing head 41 is lifted, and the input carrier 6 movesout of the test zone 4, as shown in FIG. 4C and FIG. 5C.

As shown in FIG. 5C-1 , the pressing head 41 is lowered to place theelectronic devices Cy to be tested into the test sockets 42, and thesystem starts to test the electronic devices Cy to be tested. During thetest, the electronic devices Cy to be tested are pressed by the pressinghead 41 so that the electronic devices Cy to be tested can be kept inelectrical contact with the test sockets 42.

After the test is completed (i.e., the electronic devices Cy to betested become the tested electronic devices Cf), the pressing head 41picks up the tested electronic devices Cf from the test sockets 42 andis lifted as shown in FIG. 5C-2 . Next, the output carrier 7 moves fromthe discharging buffer zone 70 to the test area 4, and the pressing head41 is lowered to place the tested electronic devices Cf on the outputcarrier 7, as shown in FIG. 4D and FIG. 5D.

After the pressing head 41 has placed the tested electronic devices Cfon the output carrier 7 and has been lifted, the output carrier 7 movesout of the test zone 4, and the input carrier follows immediately afterthe output carrier and successively moves into the test zone 4 at thesame speed, as shown in FIG. 4E and FIG. 5E. In other words, in thisembodiment, movement of the input carrier 6 into the test zone 4 issynchronous with movement of the output carrier 7 out of the test zone4. At this time, the pressing head 41 can pick up the electronic devicesCy to be tested as shown in FIG. 4B and FIG. 5B, and then the process asshown FIGS. 5C to 5E can be carried out in sequence.

On the other hand, after the output carrier 7 carries the testedelectronic devices Cf to the discharging buffer zone 70, the testedelectronic devices Cf are picked up by the discharging pick-and-placemodule 82 and are sorted and placed on the corresponding second tray 51in the first area 53 of the discharging zone 5 according the testresults. When the second tray 51 is fully loaded with the testedelectronic devices Cf, the second tray 51 is transferred from the firstarea 53 to the second area 54 by the tray translating device 52. Thetray knocking device 55 is enabled to knock the second tray 51 until allthe tested electronic devices Cf are exactly positioned in theelectronic device-accommodating slots.

The preferred embodiments of the present invention are illustrativeonly, and the claimed inventions are not limited to the detailsdisclosed in the drawings and the specification.

Accordingly, it is intended that it have the full scope permitted by thelanguage of the following claims.

What is claimed is:
 1. An electronic device testing apparatus,comprising: a feeding zone, for loading at least one electronic deviceto be tested; a test zone, including a pressing head and a test socket,the pressing head including a suction nozzle for picking or placing theat least one electronic device to be tested, the test socket being usedfor accommodating and testing the at least one electronic device to betest; a discharging zone, for loading at least one tested electronicdevice; an input carrier, for transferring the at least one electronicdevice to be tested into the test zone; an output carrier, fortransferring the at least one tested electronic device from the testzone; and a pick-and-place device, for transferring the at least oneelectronic device to be tested between the feeding zone and the inputcarrier, and for transferring the at least one tested electronic devicebetween the output carrier and the discharging zone, wherein after theat least one electronic device to be tested is tested in the test zoneand becomes the at least one tested electronic device, the suctionnozzle of the pressing head picks up the at least one tested electronicdevice from the test socket, the output carrier moves into the testzone, the suction nozzle of the pressing head places the at least onetested electronic device on the output carrier, the output carrier movesout of the test zone, and the input carrier follows immediately afterthe output carrier and successively moves into the test zone at the samespeed; after the suction nozzle of the pressing head picks up the atleast one electronic device to be tested from the input carrier, theinput carrier moves out of the test zone, and the suction nozzle of thepressing head places the at least one electronic device to be tested inthe test socket.
 2. The electronic device testing apparatus of claim 1,further comprising a housing, wherein the feeding zone includes a firsttray, a tray conveying device, an outer area and an inner area; theinner area of the feeding zone, the test zone, the input carrier, theoutput carrier, the pick-and-place device and at least a part of thedischarging zone are arranged in the housing; the tray conveying deviceis used for transferring the first tray from the outer area to the innerarea; the at least one electronic device to be tested is loaded on thefirst tray.
 3. The electronic device testing apparatus of claim 2,further comprising a dust-proof slide cover, arranged outside thehousing and capable of being slidably moved to cover the outer area ofthe feeding zone or slidably moved away from the outer area.
 4. Theelectronic device testing apparatus of claim 2, wherein the dischargingzone includes a second tray, a tray translating device, a first area, asecond area and a tray knocking device, the first area is provided inthe housing; the tray translating device is used for transferring thesecond tray from the first area to the second area; the at least onetested electronic device is loaded on the second tray; the tray knockingdevice is arranged in the second area and knocks the second tray at aspecific frequency.
 5. The electronic device testing apparatus of claim2, further comprising an empty tray storage zone, an empty tray bufferzone, an empty tray transferring device and an empty tray conveyingdevice, wherein the empty tray storage zone is arranged outside thehousing; the empty tray transferring device is used for transferring anempty tray from the inner area to the empty tray buffer zone, and theempty tray conveying device is used for transferring the empty tray fromthe empty tray buffer zone to the empty tray storage zone.
 6. Theelectronic device testing apparatus of claim 1, further comprising afeeding buffer zone, a discharging buffer zone and a guide rail, whereinthe feeding buffer zone, the test zone and the discharging buffer zoneare arranged in a straight line along the guide rail; the input carrierand the output carrier are coupled to the guide rail; the input carriermoves between the feeding buffer zone and the test zone, and the outputcarrier moves between the test zone and the discharging buffer zone. 7.The electronic device testing apparatus of claim 1, further comprising atemperature control zone, for regulating a temperature of the at leastone electronic device to be tested, wherein the pick-and-place deviceincludes a feeding pick-and-place module and a dischargingpick-and-place module; the feeding pick-and-place module is used fortransferring the at least one electronic device to be tested among thefeeding zone, the temperature control zone and the input carrier; andthe discharging pick-and-place module is used for transferring the atleast one tested electronic device between the output carrier and thedischarging zone.
 8. An electronic device testing method, comprising thesteps of: (A) transferring at least one electronic device to be testedfrom a feeding zone to an input carrier by a pick-and-place device; (B)transferring the at least one electronic device to be tested to a testzone by the input carrier, the test zone including a pressing head and atest socket; (C) moving the input carrier out of the test zone after theat least one electronic device to be tested is picked up from the inputcarrier by the pressing head; (D) placing the at least one electronicdevice to be tested into the test socket and testing the at least oneelectronic device to be tested by the pressing head; (E) picking up atleast one tested electronic device from the test socket by the pressinghead, moving an output carrier into the test zone, and placing the atleast one tested electronic device into the output carrier by thepressing head; (F) moving the output carrier out of the test zone whilethe input carrier follows immediately after the output carrier andsuccessively moves into the test zone at the same speed; (G) repeatingthe steps (C) to (F).
 9. The electronic device testing method of claim8, wherein in the step (A), the at least one electronic device to betested is transferred from the feeding zone to a temperature controlzone by the pick-and-place device, a temperature of the at least oneelectronic device to be tested is regulated in the temperature controlzone, and then, the at least one electronic device to be tested istransferred to the input carrier by the pick-and-place device.
 10. Theelectronic device testing method of claim 8, wherein in the step (F),after the output carrier is moved out of the test zone, the at least onetested electronic device is transferred to a second tray in adischarging zone by the pick-and-place device, wherein the dischargingzone is provided with a tray knocking device, which knocks the secondtray at a specific frequency.